AW-2001R Microwave Plasma Etch for lower RF damage process

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Allwin21 Brochures: Plasma Etcher RIE Equipment

The AW-2001R single-wafer Etcher is an automated tool designed as a flexible downstream Microwave system for high-volume wafer fabrication. AW-2001R is in direct response to manufacturer’s concerns for wafer damage, uniformity, uptime, reliability and production-proven technology

AW-2001R Applications:

• Contact Slope Etch
• Via Etch
• BPSG Etch
• LTO Etch
• TEOS Etch
• Thermal Oxide Etch
• LPCVD Nitride Etch
• PECVD Nitride Etch
• Trench Rounding
• Descum
• RIE Damage Removal
• Sodium Removal
• Planarization
• Backside Etch (Poly, Nitride, or Oxide)
• Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å)
• Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly

AW-2001R Key Features:

• Production-proven plasma etching system.
• No damage downstream plasma etcher(≤0.1 Volt CV-shift )
• “Extended” Alumina Plasma Tube for better uniformity.
• Frontside isotropic etch and backside etch if pins-up
• 75mm-150mm wafer capability.
• Varied wafer sizes capability without hardware change if necessary.
• Integrated 3-axis robotic wafer handling for increased throughput and less wafer breakage.
• Optional alignment/cooling station to prevent wafer breakage
• Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator for better process repeatability.
• Can handle 50um thickness wafer
• PC controller with Advanced Allwin21 Software Package with touch screen monitor GUI
• Can handle 50um thickness wafer
• 4 isolated gas lines with MFC’s
• Pressure control for process repeatability
• EMO, Interlocks and Watchdog function
• GEM/SECS II interface, Optional
• Light Tower, Optional
• Small Footprint
•  Made in U.S.A.

AW-2001R Software Key Features:

• Real time graphics display (GUI), process data acquisition, display, and analysis.
• Closed-loop process parameters control.
• Precise parameters profiles tailored to suit specific process requirements. 
• Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
• Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
• Validation of the recipe so improper control sequences will be revealed.
• Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
• Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
• Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
• Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
• DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
• The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
• GEM/SEC II function (Optional)

AW-2001R Specifications:

• Wafer Size: 2, 3, 4, 5, 6 inch Capability.
• Chuck Temperature: 60-110ºC (±2 ºC)
• Gases: NF3 CF4 HE O2
• Uniformity:
• 100mm : ± 3% (5% 3 sigma) *
• 150mm : ± 5% (8% 3 sigma) *
• *max.- min. /2 x average
• Reproducibility (w-t-w): 10% 3 sigma
• Particulate: 0.05p/cm2 > 0.3µm
• NO DAMAGE: ≤0.1 Volt CV-shift
• * Contact Allwin21 sales for other applications and specifications

AW-2001R Configuration:

• Main Frame with Breakers, Relays and Wires
• Pentium Class PC with AW Software
• Keyboard, Mouse, USS with SW backup and Cables
• Fixed Cassette Stations:1 Two Cassette Stations, or One Cassette Station / One Centering/Alignment Station
• Door Assembly
• Metal Shower head
• "Extended' Alumina Plasma Tube for better Uniformity.
• Orifice, Gas Cap
• Chamber Body and Top Plate
• Main Control , Distributor PCB and DC
• H1 -7X10.5 Integrated 3-Axls Solid Robot
• Water-Cooled Magnetron and Waveguide
• Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator
• 4 Isolated Gas Lines with Pneumatic Valves and MFC
• AC Box
• Main & Slow Vacuum Valves
• MKS Baratron
• Throttle Valve
• Front EMO, Interlocks
• 15-rnch Touch Screen GUI

AW-2001R Options:

• GEM/SECS II function (Software)
• Light Tower
• Vacuum Pump

Keywords: Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch