Saturday, November 21, 2015

AW-2001R Microwave Plasma Etch for lower RF damage process

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The AW-2001R single-wafer Etcher is an automated tool designed as a flexible downstream Microwave system for high-volume wafer fabrication. AW-2001R is in direct response to manufacturer’s concerns for wafer damage, uniformity, uptime, reliability and production-proven technology



AW-2001R Applications:
  • Contact Slope Etch
  • Via Etch
  • BPSG Etch
  • LTO Etch
  • TEOS Etch
  • Thermal Oxide Etch
  • LPCVD Nitride Etch
  • PECVD Nitride Etch
  • Trench Rounding
  • Descum
  • RIE Damage Removal
  • Sodium Removal
  • Planarization
  • Backside Etch (Poly, Nitride, or Oxide)
  • Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å)
  • Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly

AW-2001R Key Features:
  • Production-proven plasma etching system.
  • No damage downstream plasma etcher(≤0.1 Volt CV-shift )
  • “Extended” Alumina Plasma Tube for better uniformity.
  • Frontside isotropic etch and backside etch if pins-up
  • 75mm-150mm wafer capability.
  • Varied wafer sizes capability without hardware change if necessary.
  • Integrated 3-axis robotic wafer handling for increased throughput and less wafer breakage.
  • Optional alignment/cooling station to prevent wafer breakage
  • Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator for better process repeatability.
  • Can handle 50um thickness wafer
  • PC controller with Advanced Allwin21 Software Package with touch screen monitor GUI
  • Can handle 50um thickness wafer
  • 4 isolated gas lines with MFC’s
  • Pressure control for process repeatability
  • EMO, Interlocks and Watchdog function
  • GEM/SECS II interface, Optional
  • Light Tower, Optional
  • Small Footprint
  •  Made in U.S.A.

AW-2001R Software Key Features:
  • Real time graphics display (GUI), process data acquisition, display, and analysis.
  • Closed-loop process parameters control.
  • Precise parameters profiles tailored to suit specific process requirements. 
  • Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
  • Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
  • Validation of the recipe so improper control sequences will be revealed.
  • Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
  • Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
  • Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
  • Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
  • DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
  • The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
  • GEM/SEC II function (Optional)

AW-2001R Specifications:
  • Wafer Size: 2, 3, 4, 5, 6 inch Capability.
  • Chuck Temperature: 60-110ºC (±2 ºC)
  • Gases: NF3 CF4 HE O2
  • Uniformity:
  • 100mm : ± 3% (5% 3 sigma) *
  • 150mm : ± 5% (8% 3 sigma) *
  • *max.- min. /2 x average
  • Reproducibility (w-t-w): 10% 3 sigma
  • Particulate: 0.05p/cm2 > 0.3µm
  • NO DAMAGE: ≤0.1 Volt CV-shift
  • * Contact Allwin21 sales for other applications and specifications

AW-2001R Configuration:
  • Main Frame with Breakers, Relays and Wires
  • Pentium Class PC with AW Software
  • Keyboard, Mouse, USS with SW backup and Cables
  • Fixed Cassette Stations:1 Two Cassette Stations, or One Cassette Station / One Centering/Alignment Station
  • Door Assembly
  • Metal Shower head
  • "Extended' Alumina Plasma Tube for better Uniformity.
  • Orifice, Gas Cap
  • Chamber Body and Top Plate
  • Main Control , Distributor PCB and DC
  • H1 -7X10.5 Integrated 3-Axls Solid Robot
  • Water-Cooled Magnetron and Waveguide
  • Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator
  • 4 Isolated Gas Lines with Pneumatic Valves and MFC
  • AC Box
  • Main & Slow Vacuum Valves
  • MKS Baratron
  • Throttle Valve
  • Front EMO, Interlocks
  • 15-rnch Touch Screen GUI

AW-2001R Options:
  • GEM/SECS II function (Software)
  • Light Tower
  • Vacuum Pump



Keywords: Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch

AW-901eR and AW-903eR Plasma Etcher Semiconductor Process Equipment


The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology


AW-901eR & AW-903eR Applications:

  • Polysilicon Etch
  • Nitride Etch
  • Silicon Nitride Etch
  • Silicides Etch
  • Silicon Dioxide Etch
  • Polyimide Etch
  • Polyimide ILD Etch
  • LDD Spacer Etch
  • BCB Etch
  • Zero Layer Etch
  • Backside Etch
  • Pad Etch
  • Passivation Etch
  • Oxide/Contact/Via Etch (Down to 0.8um)
  • Titanium/Tantalum Alloy
  • Resist/SOG Planarization
  • Descum


AW-901eR & AW-903eR Key Features:

  • Production-proven plasma etching system.
  • Up to 3%-5% Uniformity.
  • Frontside and backside isotropic and anisotropic etch.
  • Process Temperature: 6-65°C .
  • 75mm-150mm wafer capability.
  • Integrated solid robotic wafer handling. Single wafer process.
  • Fixed cassette station and wafer aligner/cooling station.
  • Can handle 50um thickness wafer.
  • PC controller with Advanced Allwin21 Software.
  • Endpoint detection with Allwin21 SLOPE technology. (Optional)
  • Up to 4 gas lines with MFC’s.
  • MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W.
  • Pressure control with UPC. Throttle valve is optional.
  • Touch screen GUI.
  • EMO, Interlocks, and Watchdog function.
  • GEM/SECS II (Optional)
  • Small Footprint
  • Made in U.S.A.


AW-901eR & AW-903eR Software Key Features:

  • Real time graphics display, process data acquisition, and analysis.
  • Closed-loop process parameters control.
  • Precise parameters profiles tailored to suit specific process requirements.
  • Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
  • Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
  • Validation of the recipe so improper control sequences will be revealed.
  • Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.
  • Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
  • Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
  • Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”.
  • DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
  • The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.
  • GEM/SECS II function (Optional).
  • Advanced Allwin21 Endpoint Detection function (Optional).

AW-901eR & AW-903eR Specifications:

  • Up to 6 inch Capability
  • Throughput: 30-60 WPH, Process Dependent
  • Temperature: 6-65ºC (±2 ºC) capability
  • Gas Lines: 4 gas lines with MFCs.
  • Etcher Rate: AW-901eR: 0-8000A/minute; AW-903eR: 0-4000A/minute, Process Dependent 
  • Uniformity: Up to ±3%, Process Dependent
  • Particulate: <0.05 /cm2 (0.03um or greater)
  • Selectivity: 901eR: 2-20:1 ;    AW-903eR: 2-20:1, Process Dependent
  • MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
  • * Contact Allwin21 sales for other applications and specifications

AW-901eR & AW-903eR Configuration:

  • Main Frame, Standard
  • Pentium Class PC with AW Software
  • Keyboard, Mouse, USB with SW backup, and Cables
  • Chuck:① 3”;  ② 4”;  ③ 5”;  ④ 6”
  • Wafer Aligner/Cooling Station
  • 3-Axis Integrated Solid Robot:① H-Zero (Standard);  ② H1-7X10.5 (TTW)
  • Fixed Cassette Station
  • Chuck Assembly:① 901eR Non-anodized;   ② 903eR Anodized /W Flat;③ 903eR Anodized /wo Flat ④ 903eR Non-anodized /W Flat
  • Reactor Assembly:① 901eR Non-anodized;  ② 903eR Anodized;③ 903eR Non-anodized;  ④ 903eR High Performance;⑤ Direct Cooling;        ⑥ Non-Direct Cooling
  • Pins:① Quartz;  ② Ceramic;  ③ SST
  • Centering Ring:① Aluminum;  ② Quartz;  ③ Ceramic
  • Main Control Board
  • Gas Box /w 4 inline Gas Lines, MFC, filters, and Pneumatic valves
  • RF Matching Network with PCB
  • 13.56 MHz RF Generator (Air or Water Cooled):① MKS Elite:300HD;    MKS Elite:600HD; MKS Elite:1000HD;  ENI ACG 3;  ENI ACG 10
  • AC/DC Box
  • ATM Sensor
  • UPC Pressure Control:① 225 SCCM,901eR;  ② 2000 SCCM, 903eR
  • MKS Baratron with Pneumatic Isolation Valve
  • Main Vacuum Valves
  • Front EMO, Interlocks
  • 15-inch Touch Screen GUI

AW-901eR & AW-903eR Options:
  • EOP Module with PCB
  • GEM/SECS II function (Software)
  • Lamp tower alarm with buzzer
  • Throttle Valve Pressure Control
  • Vacuum Pump
  • Chiller for chuck and chamber
  • Through The Wall
Keywords:Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915, Tegal 701, Tegal 703, Tegal 803, Tegal 801, Tegal 981e, Tegal 983e